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Types of submissionsexpat’25 conference accepts the following types of submissions, within the scope of the conference topics (see the Calls for Papers/Demos):
– Regular Papers (4-6 pages) for the expat’25 Conference Sessions (Main Track);
– Demos (extended abstracts of 2-3 pages) for the expat’25 Exhibition Session (Demos’25);
– Regular Papers (4-6 pages) for the expat’25 Special Sessions:
- ITo-Train’25 – Immersive Technologies: Training Future Engineers
- AIEDUMED’25 – AI and Education in Engineering , Computing, and Medicine, from Pedagogy to Application
- USP’25 – Underwater sensor platforms
- IFFRM’25 – Innovation in Forest Fire Risk Management
- AI-PSSGUD’25 – AI-Powered Solutions for Smart and Green Urban Development
Regular papers should be formatted with 4 to 6 pages, two column A4 format, using the IEEE Conference paper template.
The submissions for interactive demonstrations should be prepared as a 2-3 pages extended abstract (two column A4 format, using the IEEE Conference paper template) clearly describing the proposed demonstration and its relevance for the audience of expat’25 conference.
Important: In the initial submission the authors’ names and affiliations should NOT be present to insure a double-blind review procedure.
Paper SubmissionThe submission process is performed online here.
– The initial submission should be a digital version (in PDF format) of the paper in double blind review format (i.e., with no authors’ identification) which will be reviewed and eventually accepted for publication.
– The final camera-ready version of the accepted papers/demos must be submitted in PDF format, previously verified with the IEEE PDF checker (using Publication: Other; Other Publication Title: Proceedings of the 2025 7th Experiment@ International Conference (expat’25)) and taking into consideration the reviewers’ comments. At least one of the authors must register until June 1, 2025, to attend the conference and present the paper/demo. Note that only presented papers/demos can be submitted for indexing by IEEE Xplore®.